Epoxy molding compound is a single-component thermosetting polymer composite material, which is based on epoxy resin as matrix resin, phenolic resin as curing agent, together with promoting agents, flame retardants, fillers, pigments, coupling agents and other trace components, according to a certain percentage after the first mixing, extrusion, crushing, magnetic separation, after mixing, pre-molding (play cake) and other technology made. Mainly used to encapsulate semiconductor devices such as transistors and integrated circuits. I produced a fast curing epoxy molding compounds, easy, and good molding characteristics. Specific classification and type the following:
Unit value of test items
Spiral flow length @ 175 ℃ cm 60-120
Gel time @ 175 ℃ s 15-25
Density g/cm3 1.95-2.05
Glass transition temperature ℃ 160
Coefficient of thermal expansion α1 10-6 / ℃ 27
Thermal expansion coefficient α2 10-6 / ℃ 70
Flexural strength MPa 150
Bending modulus GPa 15
Thermal conductivity w / m. / ℃ 1.5-2.0
Flame retardant UL-94 V-0
Volume resistance 1015Ω · cm 2.6
Conductivity ? s / cm <15
Na ppm <5
Cl-ppm <5
Applications Diode 126, 220 and other products DIP, SOP


 
Packaging conditions
Warm-up time 25-30 s
Die temperature 170-190 ℃
Injection pressure of 30-60 kg/cm2
Delivery time 15-20 s
Curing time 90-180 s
After the curing temperature 170-180 ℃
4-8 h after the curing time
 
Our packaging technology for more than recommended, customers can be adjusted according to actual situation packaging process.
Preheat the epoxy molding plastic material is very important, in the recommended conditions, the material can be used cake should be heated to deformation of the fingers can be pinched, soft-lead materials to avoid the preheated cake collapse. After the cake warm materials, requiring the use of in 10 seconds, so join in the cake mold material before the liquid because of chemical reactions lead to deterioration of the quality of packaging.
Packaging
This product is packed in cartons, lined with double plastic bags, placed between two bags of drying agents, each box of net weight 15kg.
 
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The product should be stored at low temperature in cold storage in dry and ventilated, 10 ℃ below the storage of 6 months.
Caution
Removed from cold storage after molding compound must be at room temperature for 8 hours or more to open the package to use, after use shall be kept sealed. Plastic material placed in the back more than 72 hours after the temperature scrapped.