Thermal fuse, thermal protection special epoxy glue HL-9045A/6822B
I. Introduction:
Room temperature curing adhesive HL-9045A/6822B electronic privacy is a dual-curing potting material at room temperature, it solidified and became dense solid structure, high hardness, heat resistance, extremely difficult to remove, can play to protect, waterproof and confidential role.
Second, the conventional performance:
Testing methods or conditions of the test project HL-9045A 6822B
Visual appearance of the black viscous liquid Colorless transparent liquid
Density 25 ℃ g/cm3 1.5 ~ 1.6 1.00 ~ 1.10
Viscosity 25 ℃ mpa · s 3000 ~ 5000 150 ~ 300
Six months shelf life at room ventilation
Third, the use of technology:
Item Unit or conditions HL-9045A/6822B
100:15 mix ratio by weight
Can use the time to 25 ℃, 35g, hrs 0.5
Curing conditions ℃ / hrs 25/24 or 60 / 3
Fourth, use: for sensors, mixed module circuit, small electronic components such as confidentiality.
Fifth, after curing characteristics:
Item Unit or conditions HL-9045A/6822B
Hardness Shore-D 80
Volume resistivity 25 ℃, Ω · cm 1.0 × 1014
Dielectric strength 25 ℃, kV / mm 18
Impact Strength Kg/cm2 7
Dielectric constant 25 ℃, 1MHZ 4.0 ± 0.05
Dielectric loss tangent 25 ℃, 1MHZ 0.02
VI, storage, transportation and precautions:
1. Such products of non-dangerous goods, as a general chemical storage and transportation, storage period, see drum.
2. Please use the sights of the product model, then the condemnation; accurate weighing, please, stir.
3. After potting the device is 80 ℃ / 1 ~ 1.5hrs dry, remove the water, cooling to 30 ~ 40 ℃.
4. Encapsulation when the attention should not be dipping fast speed to ensure even soaking.
VII Packing: packed in metal containers 5KG or 25KG.
Note: The above performance data for the product in 70% humidity, temperature 25 ℃, the typical test data for reference purposes only customers, and can not guarantee that a particular environment can be achieved when all the data. Please use customers, subject to the measured data.
